SiCore Dynamics

Artículo wiki · Colección 03

Apilado de Bobina del Pad

Referencia técnica sobre Apilado de Bobina del Pad para el diseño, integración e implementación de sistemas de energía inalámbrica.

6 minArtículo 39/50Diseño de Bobinas
Transmitter Pad Coil Stack — educational diagram
Fig.: Diagrama educativo de “Transmitter Pad Coil Stack”.

The transmitter pad coil stack orders materials from the charging face downward: wear surface, coil (often litz spiral or DD), ferrite tiles, optional aluminum spreader/shield, structural plate, and cable exit. Each interface adds thermal resistance and shifts L/C through dielectric loading and proximity to conductors.

Floor pads see mechanical abuse — stack design must survive tile compression, forklift crossings (where allowed), and thermal cycling from ambient warehouse to full power.

01Typical layers

  • Top: polyurethane or epoxy wear layer (thickness in gap budget).
  • Coil: potted or pre-potted assembly on ferrite.
  • Ferrite: tiled back-plate with defined gaps.
  • Thermal/spreader: aluminum coupling to enclosure or floor.
  • Bottom: steel or composite tray with sealed cable gland.
Transmitter Pad Coil Stack — supporting diagram
Fig.: Ilustración de apoyo para “Transmitter Pad Coil Stack”.

02Integration risks

Metal screws through the stack near the coil create eddy loss and asymmetry — use non-magnetic fasteners or keep them outside the flux path. Reinforcing rebar under cast floors couples flux — pad location vs rebar mesh matters for in-floor installs.

03Service

  • Modular coil-ferrite cartridges reduce floor downtime.
  • Mark stack version on pad label — mixed revisions in one lane skew power.
  • Lift-and-replace procedure for tile without disturbing coil alignment to floor datum.