Wiki article · Collection 03
Transmitter Pad Coil Stack
Engineering reference on Transmitter Pad Coil Stack for wireless power system design, integration, and deployment.
The transmitter pad coil stack orders materials from the charging face downward: wear surface, coil (often litz spiral or DD), ferrite tiles, optional aluminum spreader/shield, structural plate, and cable exit. Each interface adds thermal resistance and shifts L/C through dielectric loading and proximity to conductors.
Floor pads see mechanical abuse — stack design must survive tile compression, forklift crossings (where allowed), and thermal cycling from ambient warehouse to full power.
01Typical layers
- Top: polyurethane or epoxy wear layer (thickness in gap budget).
- Coil: potted or pre-potted assembly on ferrite.
- Ferrite: tiled back-plate with defined gaps.
- Thermal/spreader: aluminum coupling to enclosure or floor.
- Bottom: steel or composite tray with sealed cable gland.
02Integration risks
Metal screws through the stack near the coil create eddy loss and asymmetry — use non-magnetic fasteners or keep them outside the flux path. Reinforcing rebar under cast floors couples flux — pad location vs rebar mesh matters for in-floor installs.
03Service
- Modular coil-ferrite cartridges reduce floor downtime.
- Mark stack version on pad label — mixed revisions in one lane skew power.
- Lift-and-replace procedure for tile without disturbing coil alignment to floor datum.
